Miniaturization in photonic systems continues to be a primary driver of innovation. Increasing complexity demand hybrid integration of micro-optical, micro-electronic, and micro-mechanical components on smart system platforms. The assembly of such miniaturized components and sub-assemblies in complex 3D-shaped geometries requires new approaches in handling and packaging technologies to meet the requirements in terms of accuracy during assembly as well as long term stability under various environmental conditions.
This workshop is going to address these topics.
R & D, companies (from SMEs to LMEs) and researchers in the field of optical packaging, including light sources, optical connectors, sensors, environmental / medical instrumentation and bio implants with optical sub-modules.
10:30 Registration, welcome coffee
11:00 Lab Tour CSEM
12:15 Networking Lunch
13:45 Talks at CREDIMEX (programa aquí)
17:30 Apéro Riche
Más información en la página del evento.
Registro gratuito, antes del 8 de Mayo, en esta página web