5-6 Diciembre de 2013, Rüschlikon, Switzerland. Organizado por IBMTemas
Sesión 1: InP, and Si photonics, TriPleX, individual strengths, challenges and opportunities
Sesión 2: Approaches for combining InP and Si, add functionality to Si photonics. Heterogeneous versus hybrid integration
Sesión 3: Assembly and packaging of densely integrated photonic devices: How to reduce the cost of system-level integration? Integration of electronics and photonics?